NI Multisim 13.0 | Enhanced Circuit Simulation for an Optimized Design Performance

[Mahmoud_W]

NI is happy to announce that Multisim 13.0 is now available. The R&D focus for Multisim for industrial/professional use is to add powerful design capabilities for analog and mixed-mode simulation, improve design validation, and enable rapid and accurate PCB prototyping.

Feature Highlights of Multisim 13.0 (Download the attached presentation to learn more)

Enhanced Circuit Simulation with Circuit Parameters and NI Multisim API Toolkit

User defined circuit parameters in Multisim 13.0 enable engineers to easily calculate, change and sweep critical component parameters in advanced analog and power application designs. In conjunction with parameter sweep, engineers can modify and iterate parametric information to achieve optimal values for their components/devices to better understand circuit behavior under varying conditions and performance metrics.

The NI Multisim API Toolkit is a standardization of a widely used ni.com/labs tool that enables engineers to automate simulation analyses from the NI LabVIEW environment. This unique feature (only available in NI Multisim) allows customers to extend simulation to the graphical design environment of NI LabVIEW to define countless applications, acquire and correlate measurements, as well as define domain specific analyses that are not possible with conventional simulation environments..

Accurate Simulation with 26,000+ Devices from Leading Semiconductor Manufacturers

Multisim expands upon a vast library with more devices that enable accurate design and analysis of circuit design. Included in this release is a customizable diode, IGBT, and MOSFET components with thermal behavior information for power electronics analysis.

Multisim 13.0 also brings over 26,000 components that are verified and validated by leading semiconductor manufacturers enabling accurate circuit evaluation on the desktop:

Manufacturer	New Components / Updates
Analog Devices	100+ new amplifier components for instrumentation, differential, current sense, audio, and special functions
NXP	500+ new and updated discrete BJT, diode, and zener components
EPC	eGAN MOSFET components for  efficient power application design
ON Semiconductor	400+ new discrete components
Infineon	500+ new thermal MOSFET components and 100+ new microcontroller ICs
Maxim	1300+ new components such as amplifiers and regulators
Test Mating Connectors	Updated symbol/footprint libraries from leading manufacturers such as Phoenix for developing custom accessories for test fixtures

Accelerated PCB Prototyping and Design Reuse

User configurable templates will help engineers to create, share and modify design templates that take into consideration critical devices, spacing, layout consideration and settings.  With ready-to-use daughterboard and test fixture templates for hardware such as NI myRIO, NI sbRIO, NI ELVIS, NI CompactRIO, NI myDAQ as well as platforms from Digilent or generic hardware, engineers can improve time-to-prototype.

Also included in Multisim 13.0 are numerous updates to critical features in prototyping such as multi-section components to ensure the integrity of device naming, quicker device updating/editing as well as an improved user interface.

Best Regards,

Mahmoud W

National Instruments